Electronic Potting Compound, 2-Part Epoxy, 25ml, 26.2g, Dual Syringe, Black

This potting and encapsulating compound is a general purpose, hard, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, This can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

• Convenient 1A:1B volume mix ratio
• Low mixed viscosity of 4 100 cP
• Extremely high compressive and tensile strength
• Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
• Excellent electrical insulating characteristics
• Broad service temperature range -40°C to 150°C (-40°F to 302°F)
• Extreme resistance to water and humidity (allows for submersion where needed)
• Solvent-free